Spark Logic

MOS 6502 pinout

Original NMOS 6502 microprocessor with an 8-bit data bus and 16-bit address bus. It addresses 64 KiB of external memory and I/O and requires external RAM and ROM.

DIP-40

40 contacts Current package

MOS Technology / Commodore Semiconductor Group · MPS plastic and MCS ceramic use the same top-view 40-pin map.

2 MHz maximum. MPS6502A plastic or MCS6502A ceramic.

DIP-40 pinout

Top view · Pin 1 at upper left · Schematic outline
Selected pin details

16 · A7

Output · Outputs

Address bit 7 (AB7 in the datasheet). The external decoder uses this line to select memory and I/O.

Commodore Component Data Catalog (1981), pp. 2-1–2-2 and 2-11

Electrical limits · Link to this pin

All 40 pins

PinSignalDirectionFunction
1VSS Supply returnSupply return Connect both VSS pins to the 0 V rail.
2RDY InputInput Keep high for normal operation. A low sampled during a read holds the processor on that cycle. A pending write must complete before a read cycle can stop.
3Φ1 OUT OutputOutput Phase-one output generated from Φ0 IN. Never drive this pin.
4/IRQ InputInput Active-low level-sensitive interrupt request. IRQ is masked by the I flag after reset. Use the specified 3 kΩ pull-up for an open-drain source.
5NC NoneNone Leave this pin unconnected.
6/NMI InputInput Falling-edge nonmaskable interrupt request. Use the specified 3 kΩ pull-up for an open-drain source.
7SYNC OutputOutput High on an opcode fetch. An external circuit can use SYNC to time a pause through RDY for single-instruction stepping.
8VCC SupplySupply Regulated 5 V supply. Decouple to VSS close to the package.
9A0 OutputOutput Address bit 0 (AB0 in the datasheet). The external decoder uses this line to select memory and I/O.
10A1 OutputOutput Address bit 1 (AB1 in the datasheet). The external decoder uses this line to select memory and I/O.
11A2 OutputOutput Address bit 2 (AB2 in the datasheet). The external decoder uses this line to select memory and I/O.
12A3 OutputOutput Address bit 3 (AB3 in the datasheet). The external decoder uses this line to select memory and I/O.
13A4 OutputOutput Address bit 4 (AB4 in the datasheet). The external decoder uses this line to select memory and I/O.
14A5 OutputOutput Address bit 5 (AB5 in the datasheet). The external decoder uses this line to select memory and I/O.
15A6 OutputOutput Address bit 6 (AB6 in the datasheet). The external decoder uses this line to select memory and I/O.
16A7 OutputOutput Address bit 7 (AB7 in the datasheet). The external decoder uses this line to select memory and I/O.
17A8 OutputOutput Address bit 8 (AB8 in the datasheet). The external decoder uses this line to select memory and I/O.
18A9 OutputOutput Address bit 9 (AB9 in the datasheet). The external decoder uses this line to select memory and I/O.
19A10 OutputOutput Address bit 10 (AB10 in the datasheet). The external decoder uses this line to select memory and I/O.
20A11 OutputOutput Address bit 11 (AB11 in the datasheet). The external decoder uses this line to select memory and I/O.
21VSS Supply returnSupply return Connect both VSS pins to the 0 V rail.
22A12 OutputOutput Address bit 12 (AB12 in the datasheet). The external decoder uses this line to select memory and I/O.
23A13 OutputOutput Address bit 13 (AB13 in the datasheet). The external decoder uses this line to select memory and I/O.
24A14 OutputOutput Address bit 14 (AB14 in the datasheet). The external decoder uses this line to select memory and I/O.
25A15 OutputOutput Address bit 15 (AB15 in the datasheet). The external decoder uses this line to select memory and I/O.
26D7 BidirectionalBidirectional Data bit 7 (DB7 in the datasheet). External memory or I/O drives it on reads, and the CPU drives it on writes.
27D6 BidirectionalBidirectional Data bit 6 (DB6 in the datasheet). External memory or I/O drives it on reads, and the CPU drives it on writes.
28D5 BidirectionalBidirectional Data bit 5 (DB5 in the datasheet). External memory or I/O drives it on reads, and the CPU drives it on writes.
29D4 BidirectionalBidirectional Data bit 4 (DB4 in the datasheet). External memory or I/O drives it on reads, and the CPU drives it on writes.
30D3 BidirectionalBidirectional Data bit 3 (DB3 in the datasheet). External memory or I/O drives it on reads, and the CPU drives it on writes.
31D2 BidirectionalBidirectional Data bit 2 (DB2 in the datasheet). External memory or I/O drives it on reads, and the CPU drives it on writes.
32D1 BidirectionalBidirectional Data bit 1 (DB1 in the datasheet). External memory or I/O drives it on reads, and the CPU drives it on writes.
33D0 BidirectionalBidirectional Data bit 0 (DB0 in the datasheet). External memory or I/O drives it on reads, and the CPU drives it on writes.
34R/W OutputOutput High for read, low for write. The pin is specified as valid after the power-up reset hold time.
35NC NoneNone Leave this pin unconnected.
36NC NoneNone Leave this pin unconnected.
37Φ0 IN InputInput Single-phase time base for the on-chip two-phase clock. Keep the clock running during reset and use the timing table for the marked speed grade.
38SO InputInput A falling edge sets the processor status overflow flag. Hold at a defined high level when unused.
39Φ2 OUT OutputOutput Phase-two output generated from Φ0 IN. Used as the timing reference for the external data bus.
40/RES InputInput Hold low during power-up. After release and initialization, the CPU reads the low byte from 0xFFFC and the high byte from 0xFFFD.

Signal assignments

Interrupts

IRQ is level-sensitive and maskable. NMI is edge-sensitive. Both are active low.

Reset and execution control

Use reset at power-up. SYNC identifies opcode fetches, and RDY pauses reads. SO can set the overflow flag independently of the instruction stream.

Electrical limits

ParameterLimitConditions and source
Operating supply4.75–5.25 V4.75–5.25 V VCC relative to VSS. Published operating temperature range 0–70 °C. MOS Technology Data Catalog (1982–1983), p. 2-16
Input operating levelsLOW ≤ 0.4 V, HIGH ≥ 2.4 VLOW ≤ 0.4 V, HIGH ≥ 2.4 V Logic and Φ0 IN at 0–70 °C. The catalog separately lists 0.8 V and 2.0 V threshold limits for RES, IRQ, NMI, RDY, SO and data. MOS Technology Data Catalog (1982–1983), p. 2-16
Logic output levelsLOW ≤ 0.4 V at 1.6 mA, HIGH ≥ 2.4 V at 100 µA sourceLOW ≤ 0.4 V at 1.6 mA, HIGH ≥ 2.4 V at 100 µA source A0–A15, D0–D7, R/W and SYNC at VCC = 4.75 V. Check clock loading separately. MOS Technology Data Catalog (1982–1983), p. 2-16
Clock frequency50 kHz minimum, 1 / 2 / 3 MHz maximum50 kHz minimum, 1 / 2 / 3 MHz maximum Maximum by grade. Keep the clock running during reset and when using RDY. MOS Technology Data Catalog (1982–1983), pp. 2-14 and 2-18
Absolute voltage limits−0.3 to +7.0 V−0.3 to +7.0 V VCC and input stress limits relative to VSS. Use the operating values for circuit design. Commodore Component Data Catalog (1981), p. 2-6
Interrupt pull-ups3 kΩ each to VCC3 kΩ each to VCC IRQ and NMI. At 5.25 V the external open-drain device must sink about 1.75 mA at low output voltage. Commodore Component Data Catalog (1981), p. 2-7 and signal descriptions

Models and documents

Covers the MOS Technology / CSG NMOS 6502 map. The related 6503–6507 and 6512–6515 have their own maps in the catalog. WDC W65C02S is a distinct CMOS part with different pin assignments and timing.

6502
1 MHz maximum. MPS6502 plastic or MCS6502 ceramic.
6502A
2 MHz maximum. MPS6502A plastic or MCS6502A ceramic.
6502B
3 MHz maximum. MPS6502B plastic or MCS6502B ceramic. See the 1982–1983 catalog for 3 MHz timing.
  • Commodore Component Data Catalog (1981)· Manufacturer catalog scan. Cross-reference p. 1-3, MPU signals and electrical data pp. 2-1–2-10, 6502 pinout p. 2-11. Scan SHA-256 ddc2be52d8b14c99b28e0a2d2d116bcaa1c4c241b4005e06b4459d96e2566902.
  • MOS Technology Data Catalog (1982–1983)· Manufacturer data catalog. NMOS MPU order codes on p. 2-14 and 1, 2 and 3 MHz timing on p. 2-18. Scan SHA-256 1a6152082a15479e893a9c3391cafc4aba135dfae0613a96fbcbe12ac44248ca.
  • WDC W65C02S datasheet· Separate CMOS derivative. Compare its pin assignments and electrical conditions before designing a replacement.