In case anyone is vaguely interested
I eventually coded a I2C slave to interface with the Maxim thermocouple chips (which are SPI) using an Arduino Pro mini.
I put the oven back together using the Maxim chips for both internal thermocouples and the problem seemed to be fixed as both thermocouples read the same value at room temperature
Anyway, When I tried to use the oven, I found it was not getting hot enough to melt the solder paste, unless I set the temperature at about 30 deg higher than is correct.
Initially I thought the issue was that the oven has hotspots as its not got anything inside it to circulate the air I.e no internal fan.
So, in case this was the issue, I thought I’d get out one of those hot air paint stripping tools, and blow air in through the front by opening the drawer a bit, and blowing it in.
Anyway, Looking at the thermocouple readouts on the display; even if I blow air in, the thermocouple on the right seems to read higher than the one on the left,by around 20 deg, perhaps more. This was even if I move the hot air tool around from one side to the other.
So, I’m now not sure if one of both of the thermocouples is faulty, which may or may not have been the original problem.
It did also give me an idea for a better reflow oven…. Use a hot air paint stripper !
As far as I can tell, they are capable of delivering hot air well in excess of the 225 deg C that is required for lead based solder and actually capable of delivering air in excess of 300 deg (some places even quote 400 deg C or more, much more..)
I can get a “variable” heat one for $50 locally, but in reality, you would need to strip the thing apart, and control the motor and the heating elements separately, as the motor speed will be too high, as its likely to blow the components off the board.
Perhaps in conjunction with a toaster oven as a enclosure, this could be a better solution to reflowing boards .