74HC165 connection guide
Wire and test a Texas Instruments SN74HC165 for parallel capture, serial readout or a two-chip chain.
Connect and bypass the supply
With power off, connect the regulated 4.5 V rail to 16 VCC and the supply return to 8 GND. Use a common ground for the host, the register and the test instrument. Fit one 100 nF ceramic capacitor directly across pins 16 and 8 of each chip, close to the package.
Complete the signal wiring before power-up. Then measure 4.5 V at pin 16 with the meter common at pin 8. Keep the host outputs from driving the chip while its supply is off.
Connect the data and control signals
Load eight inputs in parallel
Use fast CMOS host outputs that swing between GND and the same 4.5 V rail. The receiver on 9 QH must accept that swing. Leave 7 Q̅H open. VCC and GND labels in the signal schematic refer to the same rails as in the power step.
Signal wiring for the test pattern
| Pin | Connect to |
|---|---|
| 1 SH/LD | Host LOAD |
| 2 CLK | Host CLK |
| 15 CLK INH | GND |
| 10 SER | GND for zero fill |
| 9 QH | Host input |
| 11 A,13 C,14 D,4 F | U1 to VCC |
| 12 B,3 E,5 G,6 H | U1 to GND |
Check the result
- Keep 2 CLK LOW and CLK INH grounded. With A–H stable, drive 1 SH/LD LOW for at least 1 µs, then HIGH. Keep the data stable throughout the LOW interval.
- Let QH settle after the load. With a high-impedance scope probe or meter referenced to pin 8, check pin 9 before clocking. The example ties H to GND, so QH should be LOW. To verify the HIGH case, power off, move H to VCC, then power up and repeat the load. QH should be HIGH.
At 4.5 V TI specifies a settled LOW of at most 0.1 V at 20 µA sink current and a settled HIGH of at least 4.4 V at 20 µA source current. If the sequence is offset by one bit, check the first sample relative to CLK. If you drive CLK INH in another design, raise it only while CLK is HIGH. Raising it while CLK is LOW in shift mode can clock an extra bit.
Package and documents
TI package code D · approximately 9.9 × 3.9 mm body · 1.27 mm lead pitch. Use the outline drawing for footprint dimensions and tolerances.
- Active order codes
- SN74HC165DR, SN74HC165DR.A, SN74HC165DRG3, SN74HC165DRG3.A
- Last time buy
- SN74HC165DRE4, SN74HC165DRG4, SN74HC165DRG4.A
- TI SNx4HC165 datasheet (PDF)· Texas Instruments SCLS116H, Rev. H (December 2015), package option addendum 23 October 2026
- TI SOIC-16 package outline (PDF)· MPDS178G
- TI SN74HC165 product and ordering information
Package status is from TI's 23 October 2026 addendum, pp. 1–2. Circuit sources: §§5, 6.3, 6.7, 6.10, 6.13, 8.2–8.4, 9.2 Figure 5 and 10.
